Description

YCS No.2 CPU Prying Blade – Precision Tool for Chip & Adhesive Removal

The YCS No.2 CPU Prying Blade is a professional-grade tool crafted specifically for delicate and high-precision mobile motherboard work. Designed to remove IC chips, hard disks, and stubborn adhesive materials without damaging nearby components, this blade is a must-have for technicians working on smartphone, tablet, or small electronic PCB repairs.

 Key Features:

• Ultra-Thin Precision Blade:
  Engineered with a razor-thin stainless steel edge to safely slide under CPU chips, NANDs, and hard disks without applying excessive force.
• Durable & Flexible Design:
  Made from high-quality alloy steel, this blade offers excellent flexibility and toughness — strong enough to tackle hardened adhesives but gentle on delicate circuit boards.
• Comfort Grip Handle:
  The ergonomic anti-slip handle ensures maximum control during repairs, allowing you to operate steadily even in tight spaces.
• Ideal for IC & Adhesive Removal:
  Perfect for removing BGA chips, glue residue, thermal paste, and other board-level adhesives with precision.
• Corrosion-Resistant Finish:
  Long-lasting blade coating helps prevent rust and wear over time, even with frequent usage.

Package Includes:

• 1 x YCS No.2 CPU Prying Blade

Applications:

• Mobile motherboard chip lifting
• Hard disk and NAND removal
• Adhesive separation on logic boards
• Suitable for iPhone, Android, and other smart device repairs

Whether you’re performing NAND upgrades, CPU replacements, or board-level refurbishing, the YCS No.2 Prying Blade delivers the precision and reliability professionals demand. Upgrade your toolkit with a blade that’s built for modern electronics.