Description

YCS Magnetic Pad – Tin Planting Arc Motherboard CPU NAND IC Repair Pad

Full Product Description:
Take your precision soldering and IC repair work to the next level with the YCS Magnetic Pad Tin Planting Arc Motherboard CPU NAND IC Repair Pad — a professional-grade tool specifically crafted for advanced logic board repairs and CPU/NAND chip operations.

This innovative repair pad features a curved (arc) magnetic base that provides superior grip and alignment for tiny components during delicate tasks such as tin planting, desoldering, and reballing. The intelligently designed surface ensures your components stay securely in place, minimizing movement and risk of damage.

Crafted with heat-resistant and durable materials, the pad withstands high working temperatures, making it suitable for repeated soldering sessions. The anti-static coating protects sensitive ICs and logic boards, while the non-slip bottom ensures it stays firmly in place during use.

Whether you’re reballing a NAND chip or working on intricate BGA soldering, the YCS Magnetic Arc Repair Pad helps boost efficiency, precision, and safety for professional mobile repair technicians.

Key Features:

• ✅ Curved Magnetic Design – Helps hold ICs, CPU, and NAND chips firmly during tin planting and reballing.
• ✅ Anti-Static Surface – Protects sensitive components from ESD damage.
• ✅ High Heat Resistance – Engineered for durability under hot air and soldering tools.
• ✅ Enhanced Stability – Non-slip base prevents sliding during intricate work.
• ✅ Professional-Grade Tool – Ideal for mobile phone motherboard and chip-level repairs.

Applications:

• Tin planting for CPU/NAND
• BGA chip reballing
• Precision IC positioning
• Logic board repair
• Soldering and desoldering tasks

Upgrade your workbench with the YCS Magnetic Arc Repair Pad and experience smoother, safer, and more stable repair sessions with every project.