Description
MECHANIC XP7 iSoldering X PPD Solder Paste 148°C (60G)
Take your micro-soldering and motherboard repair to the next level with Mechanic XP7 iSoldering X PPD Solder Paste (148 °C, 60 g) — a premium low-temperature flux paste engineered for modern smartphones, PCBs, and precision electronics. With a low melting point of just 148 °C, the XP7 paste ensures safer, cleaner soldering with less thermal stress on delicate components.
The XP7 formula offers optimal viscosity and stability, preventing solder migration while providing excellent wettability and bright, full solder joints — no cold joints or residue. It’s especially suited for layered motherboard designs found in high-end smartphones (e.g., iPhone X series) where traditional fluxes struggle.
Designed for ease of use, it’s packed in a 60 g jar — enough for extensive repair jobs — and works smoothly in rework stations, hot-air tools, or soldering irons. Whether you’re doing BGA reballing, logic board repair, IC replacement, or very fine SMD work, this paste keeps your workflow smooth and reliable.
Key Benefits & Features:
- Low-temperature melt at 148 °C for safer component handling
- High wettability and stable viscosity minimize flux drift
- Bright, clean joints with no false soldering or residue
- Ideal for smartphone motherboards, PCBs, and delicate electronics
- 60 g capacity for extended use
- Compatible with hot-air reflow, soldering irons, and BGA stations
