IC/edge rubber removal: 21/16/22/23/24/25/26/29/30/34
CPU /motherboard layered: 01/02/03/04/11/18/19/28
Remove hard disk/baseband: 06/09/12/14/20/32/33
Shovel glue/remove glue: 05/07/08/10/27/13/15/17/30
Product Function :
Crescent Knife for iPhone A8 A9 A10 A11 A12 CPU BGA chip.
Crooked Knife Disassemble Cleaning Pry tool for mobile phone motherboard sealant glue.
UV Glue Cleaning Tool and crooked shovel Knife for Removing the motherboard sealant glue.
Solder Paste Scraping Knife for cell Phone BGA Repair and UV Glue Cleaning Tool.
Product Features :
Handmade sharpening and grinding: Pure manual cutting edge grinding
Real gold plating process : Standardized 5UM nickel layer process real gold plating molecular surface treatment anti-oxygen and anti-corrosion.
Special grade 4A material : Adopt 0.1mm imported AAAA steel, soft and tough, strong heat and wear resistance.
Non-slip fine lines design : 8mm diameter, comfortable grip, ergonomic design.
Double handle : Adopt 0.1mm imported AAAA steel, soft and tough, strong heat and wear resistance.