MARTVIEW RB-03 Universal BGA Reballing 36 Stencils with Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template

Description

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MARTVIEW RB-03 Universal BGA Reballing Stencils with Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template

Features:

• Suitable for 99% ICs in the market
• Fast automatic adjust button and magnet
• Positioning accuracy standards, clamping speed, high efficiency
• High precision for adjusting the chip, magnet inside, auto fix, more fast and convenient
• Powerful magnet, is easy to use, save money and time
• Imported alloy steel, high material, and technology, dirt-resistant, easy to clean.
• Rigid and flexible stencil, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
• High precision, no burrs, so that every mesh can be of the same size and not stuck
• Maximum support chip size: 45mm*45mm
• Minimum support chip size: 1.6mm*1.6mm
• Holder size: 70*70*24mm
• Packing size: 177*91*26mm

Function Introduction:

• Built-in Knob adjusts lateral movement of the chip holder Module, inward or outward simultaneously.
• Built-in Large turntable adjusts the longitudinal movement of the two chip holder module, inward or outward simultaneously.
• Built-in four lifting screws are designed to adjust the height of the stencil positioning module, so that it is suitable for chip bead planting and tin scraping of different thicknesses.
• The four corners are marked with scales and direction marks, the scales can be better set to support chips of different thicknesses, the direction marks can quickly distinguish the up and down movement methods.
• Built-in turn the screw to lock the turntable to prevent accidentally touching the turntable and causing the fixed chip to fall off.
• Built-in unique hidden tin ball pouring slot design, quick and convenient to pour out excess tin balls.

Stencil Specification:
IP A8-A17 CPU 10pcs Stencil Features:

• Support A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 CPU RAM (iPhone 6/6 plus, iPhone 6S/6s plus, iPhone 7/7 plus, iPhone 8/8 plus, iPhone X/XS/XS Max/XR, iPhone 11/11Pro/11Pro Max, iPhone 12 mini/12/12 Pro/12 Pro Max, iPhone 13 mini/13/13 Pro/13 Pro Max, iPhone 14/14 Plus/14 Pro/14 Pro Max, iPhone 15/15 Plus/15 Pro/15 Pro Max)
• Stencil net thickness: 0.12mm
• Square holes and rounded corners

EMMC UFS 7pcs Stencil Features:

• Support for EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 BGA297 all size
• Stencil net thickness: 0.12mm
• Square holes and rounded corners

Universal BGA 7pcs Stencil Features:

• P:0.3 50X50: Spacing:0.3
• P:0.35 50X50: Spacing:0.35
• P:0.4  50X50: Spacing:0.4
• P:0.5 50X50: Spacing:0.5
• P:0.35 45° 50X50: Spacing:0.35
• P:0.4 45° 50X50: Spacing:0.4
• P:0.4 D 50X50: Spacing:0.4
• Stencil net thickness: 0.12mm
• Square holes and rounded corners

0.5-1.5MM Universal 12pcs Stencil Features:
This stencil is used for Solder Balls

• 0.25MM P:0.5: Solder Balls size: 0.25mm Spacing:0.5
• 0.3MM P:0.58: Solder Balls size: 0.3mm Spacing:0.58
• 0.35MM P:0.65: Solder Balls size: 0.35mm Spacing:0.65
• 0.4MM P:0.7: Solder Balls size: 0.4mm Spacing:0.7
• 0.45MM P:0.78: Solder Balls size: 0.45mm Spacing:0.78
• 0.5MM P:0.8: Solder Balls size: 0.5mm Spacing:0.8
• 0.55MM P:1.02: Solder Balls size: 0.55mm Spacing:1.02
• 0.6MM P:0.9: Solder Balls size: 0.6mm Spacing:0.9
• 0.6MM P:1.0: Solder Balls size: 0.6mm Spacing:1.0
• 0.6MM P:1.1: Solder Balls size: 0.6mm Spacing:1.1
• 0.76MM P:1.27: Solder Balls size: 0.76mm Spacing:1.27
• 1.0MM P:1.5: Solder Balls size: 1.0mm Spacing:1.5
• Stencil net thickness: 0.2mm
• Circular hole

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