Amaoe LPDDR-1 Stencil For EMMC

AMAOE LPDDR-1 Stencil for eMMC/EMCP/UFS IC – Professional BGA Reballing Tool

The AMAOE LPDDR-1 BGA Reballing Stencil is engineered for professional mobile repair technicians and electronics specialists who require unmatched precision during IC chip rework. Made from high-strength Japanese steel sheet, this stencil features a precise square hole pattern that aligns perfectly with BGA pads, enabling controlled solder paste or ball application for flawless reballing.

Ideal for reballing tasks on eMMC, EMCP, or UFS memory chips, the LPDDR-1 stencil helps eliminate solder bridging and improves solder joint reliability. Its durable construction ensures consistent performance across multiple repair sessions, making it a must-have tool in any professional workshop.

Key Features:

• Precision 0.15 mm laser-cut BGA stencil for accurate solder application
• Designed for eMMC, EMCP & UFS IC chip reballing
• High-strength Japanese steel sheet for enhanced durability
• Square aperture design for uniform solder paste deposition
• Heat resistant and reusable construction
• Reduces solder bridging and alignment errors
• Lightweight and easy to handle
• Ideal for mobile motherboard and chip-level repair
• Supports multiple BGA IC package sizes

Technical Specifications:

• Brand: AMAOE
• Model: LPDDR-1 Stencil
• Material: Japanese steel sheet (high-strength)
• Thickness: 0.15 mm
• Hole Type: Square aperture
• Use: BGA reballing / solder paste application
• Compatibility: eMMC / EMCP / UFS IC chips
• Reusable: Yes
• Application Field: Mobile motherboard repair